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NS6W183-H3-E -0- SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED MODEL : NS6W183T-H3 NICHIA CORPORATION Nichia STS-DA1-0634C -1- 1.SPECIFIC...

-0- SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED MODEL : NS6W183T-H3 NICHIA CORPORATION Nichia STS-DA1-0634C -1- 1.SPECIFICATIONS (1) Absolute Maximum Ratings (Ta=25°C) Item Symbol Absolute Maximum Rating Unit Forward Current IF 800 mA Pulse Forward Current IFP 900 mA Allowable Reverse Current IR 85 mA Power Dissipation PD 3.2 W Operating Temperature Topr -40 ~ + 100 °C Storage Temperature Tstg -40 ~ + 100 °C Dice Temperature Tj 135 °C IFP Conditions : Pulse Width ≤ 10msec. and Duty ≤ 1/10 (2) Initial Electrical/Optical Characteristics (Ta=25°C) Item Symbol Condition Typ. Max. Unit Forward Voltage VF IF=700[mA] (3.5) 4.0 V Luminous Flux½ φv IF=700[mA] (195) - lm x - IF=700[mA] 0.344 - - Chromaticity Coordinate½½ y - IF=700[mA] 0.355 - - Color Rendering Ra IF=700[mA] (85) - - ½ Luminous flux value is traceable to the CIE 127:2007-compliant national standards. ½½ Please refer to CIE 1931 chromaticity diagram. (3) Ranking (Ta=25°C) Item Symbol Condition Min. Max. Unit Rank M 3.6 4.0 Rank L 3.2 3.6 Forward Voltage Rank K VF IF=700[mA] 2.8 3.2 V Rank C215 215 230 Rank C200 200 215 Rank C185 185 200 Rank C170 170 185 Luminous Flux Rank C155 φv IF=700[mA] 155 170 lm Color Rendering - Ra IF=700[mA] 75 - - ½ Forward Voltage Measurement allowance is ± 3%. ½ Luminous Flux Measurement allowance is ± 7%. ½ Color Rendering Measurement allowance is ± 5. Color Ranks (IF=700mA,Ta=25°C) Rank sw50 Rank sw57 x 0.3366 0.3376 0.3548 0.3515 x 0.3221 0.3207 0.3376 0.3366 y 0.3369 0.3616 0.3736 0.3487 y 0.3261 0.3462 0.3616 0.3369 Nichia STS-DA1-0634C -2- Rank sw65 x 0.3070 0.3040 0.3207 0.3221 y 0.3113 0.3300 0.3462 0.3261 ½ Color Coordinates Measurement allowance is ± 0.01. ½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to “CHARACTERISTICS” on the following pages. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to “OUTLINE DIMENSIONS” on the following page. 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to “TAPING DIMENSIONS” and “PACKING ”on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; {¯¯¯¯ - { - Year ( 8 for 2008, 9 for 2009 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. ) ¯¯¯¯ - Nichia's Product Number - Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Forward Voltage Nichia STS-DA1-0634C -3- 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Standard Test Method Test Conditions Note Number of Damaged Resistance to Soldering Heat (Reflow Soldering) JEITA ED-4701 300 301 Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) 2 times 0/22 Solderability (Reflow Soldering) JEITA ED-4701 303 303A Tsld=245 ± 5°C, 5sec. using flux Lead-free Solder (Sn-3.0Ag-0.5Cu) 1 time over 95% 0/22 Temperature Cycle JEITA ED-4701 100 105 -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 100 cycles 0/50 Moisture Resistance Cyclic JEITA ED-4701 200 203 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle 10 cycles 0/22 High Temperature Storage JEITA ED-4701 200 201 Ta=100°C 1000 hrs. 0/22 Temperature Humidity Storage JEITA ED-4701 100 103 Ta=60°C, RH=90% 1000 hrs. 0/22 Low Temperature Storage JEITA ED-4701 200 202 Ta=-40°C 1000 hrs. 0/22 Steady State Operating Life Ta=25°C, IF=800mA Tested with Nichia standard circuit board.½ 1000 hrs. 0/22 Steady State Operating Life of High Temperature Ta=100°C, IF=250mA Tested with Nichia standard circuit board.½ 1000 hrs. 0/22 Steady State Operating Life of High Humidity Heat 60°C, RH=90%, IF=550mA Tested with Nichia standard circuit board.½ 500 hrs. 0/22 Steady State Operating Life of Low Temperature Ta=-40°C, IF=700mA Tested with Nichia standard circuit board.½ 1000 hrs. 0/22 Vibration JEITA ED-4701 400 403 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 48min. 0/22 Adhesion Strength JEITA ED-4702 5N, 10 ± 1 sec. 1 time 0/22 Electrostatic Discharges JEITA ED-4701 300 304 R=1.5kΩ, C=100pF Test Voltage=2kV 3 times Negative/Positive 0/22 ½ Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 35°C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Item Symbol Test Conditions Min. Max. Forward Voltage VF IF=700mA - Initial Level ¯ 1.1 Luminous Flux φv IF=700mA Initial Level ¯ 0.7 - ½ The test is performed after the board is cooled down to the room temperature. Nichia STS-DA1-0634C -4- 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to red as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 ± 5°C · This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. · After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. Nichia STS-DA1-0634C -5- (3) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. (4) Application Design Considerations · In designing a circuit, the current through each LED must not exceed its absolute maximum rating. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. · This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED to improve the operational characteristics of the LED. · The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts1. Tj=Ta + RjaW 1 Tj=Ts1 + Rjs1W 2 ½Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C, Ts1 = Solder Temperature (Cathode Side) : °C, Rja = Heat resistance from Dice to Ambient temperature : °C /W, Rjs1 = Heat resistance from Dice to Ts1 measuring point ≒ 10°C /W, W = Inputting Power (IF ¯ VF) : W (A) (B) ...... Ts1 point Nichia STS-DA1-0634C -6- · Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs. Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist and warpage of the board. When mechanical stress from the board affects the soldered LED, place the LED in the preferable location and orientation as shown above. · Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. · When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment. Hand brake without these tools and equipment may not be used. 【Non-preferable】【Preferable】 Cathode mark Cathode mark Perforated line Slit ＥＡＣＤＢ Stress : A > B > C > D > E Nichia STS-DA1-0634C -7- (5) Handling Precautions · Bare Hand When handling the product, touching encapsulant with bare hands will contaminate its surface that could affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might result in catastrophic failure of the LEDs due to wire deformation and/or breakage. · Tweezers Since silicone used as encapsulating resin in this product is a soft material, the upper surface of the product is soft. Pressuring onto the product might cause catastrophic failure of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment. · Pick and Place Recommended conditions : Outer nozzle ≥ φ 4.3 mm ½Avoid direct contact to the encapsulant with the picking up nozzle. Failure to comply might result in damage to encapsulant and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. · Drop Please note that a package damage such as crack might occur when having dropped the product. Nichia STS-DA1-0634C -8- · Printed Circuit Board Assembled (PCB with LEDs soldered) Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment. Nichia STS-DA1-0634C -9- (6) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip or hand soldering method. · Recommended soldering conditions Reflow Soldering Lead Solder Lead-free Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 120 ~ 150°C 120 sec. Max. 240°C Max. 10 sec. Max. refer to Temperature - profile 1. 180 ~ 200°C 120 sec. Max. 260°C Max. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) ½ Although the recommended soldering conditions are specified in the above table, reflow soldering at the lowest possible temperature is desirable for the LEDs. ½ A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. [Recommended soldering pad design] Use the following conditions shown in the figure. Thin line boxes：Solder resist opening Thick line boxes：Land pattern Please connect Cathode 1 with Cathode 2. · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the customer use the nitrogen reflow method. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · Cathode 2 is to be soldered. If not, please use the heat conductive adhesive. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. (Unit : mm) <1 : Lead Solder> <2 : Lead-free Solder> 120sec.Max. Pre-heating 260°C Max. 10sec. Max. 60sec.Max. Above 220°C 1 ~ 5°C / sec. 1 ~ 5°C / sec. 180 ~ 200°C Pre-heating 240°C Max. 10sec. Max. 60sec.Max. Above 200°C 2.5 ~ 5°C / sec. 2.5 ~ 5°C / sec. 120 ~ 150°C 120sec.Max. 3. 9 (4 .3 ) Nichia STS-DA1-0634C -10- (7) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (8) Safety Guideline for Human Eyes · The International Electrical Commission (IEC) published in 2006 IEC 62471:2006 Photobiological safety of lamps and lamp systems which includes LEDs within its scope. Meanwhile LEDs were removed from the scope of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which included LED sources within its scope. However, keep in mind that some countries and regions have adopted standards based on the IEC laser safety standard IEC 60825-1:2001 which includes LEDs within its scope. Following IEC 62471:2006, most of Nichia LEDs can be classified as belonging to either Exempt Group or Risk Group 1. Optical characteristics of a LED such as radiant flux, spectrum and light distribution are factors that affect the risk group determination of the LED. Especially a high-power LED, that emits light containing blue wavelengths, may be in Risk Group 2. Great care should be taken when viewing directly the LED driven at high current or the LED with optical instruments, which may greatly increase the hazard to your eyes. (9) Others · NS6W183-H3 complies with RoHS Directive. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement

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