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JOINTINDUSTRYSTANDARDMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevicesIPC/JEDECJ-STD-020D.1March2008SupersedesIPC/JEDECJ-STD-020DAugust2007NoticeIPCandJEDECStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneed.ExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofIPCorJEDECfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublications,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanIPCorJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.RecommendedStandardsandPublicationsareadoptedbyIPCorJEDECwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocesses.Bysuchaction,IPCorJEDECdonotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublication.Usersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringement.ThematerialinthisjointstandardwasdevelopedbytheIPCPlasticChipCarrierCrackingTaskGroup(B-10a)andtheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesForTechnicalInformationContact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,VA22201-3834www.jedec.orgIPC3000LakesideDrive,Suite309SBannockburn,Illinois60015-1249Tel847615.7100Fax847615.7105PleaseusetheStandardImprovementFormshownattheendofthisdocument.©Copyright2008.JEDEC,Arlington,Virginia,andIPC,Bannockburn,Illinois.AllrightsreservedunderbothinternationalandPan-Americancopyrightconventions.Anycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStates.IPC/JEDECJ-STD-020D.1Moisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevicesAjointstandarddevelopedbytheIPCPlasticChipCarrierCrackingTaskGroup(B-10a)andtheJEDECJC-14.1CommitteeonReliabilityTestMethodsforPackagedDevicesUsersofthisstandardareencouragedtoparticipateinthedevelopmentoffuturerevisions.Contact:JEDECSolidStateTechnologyAssociation2500WilsonBoulevardArlington,VA22201-3834www.jedec.orgIPC3000LakesideDrive,Suite309SBannockburn,Illinois60015-1249Tel847615.7100Fax847615.7105Supersedes:IPC/JEDECJ-STD-020D-August2007IPC/JEDECJ-STD-020C-July2004IPC/JEDECJ-STD-020B-July2002IPC/JEDECJ-STD-020A-April1999J-STD-020-October1996JEDECJESD22-A112IPC-SM-786A-January1995IPC-SM-786-December1990ASSOCIATIONCONNECTINGELECTRONICSINDUSTRIES®ThisPageIntentionallyLeftBlankTableofContents1PURPOSE.................................................................11.1Scope......................................................................11.2Background............................................................11.3TermsandDefinitions............................................12APPLICABLEDOCUMENTS....................................22.1JEDEC....................................................................22.2IPC..........................................................................33APPARATUS.............................................................33.1TemperatureHumidityChambers..........................33.2SolderReflowEquipment......................................33.2.1FullConvection(Preferred)...................................33.2.2Infrared...................................................................33.3Ovens......................................................................33.4Microscopes............................................................33.4.1OpticalMicroscope................................................33.4.2AcousticMicroscope..............................................33.5Cross-Sectioning....................................................33.6ElectricalTest.........................................................43.7WeighingApparatus(Optional).............................43.8BeadedThermocoupleTemperatureMeasurement..........................................................44CLASSIFICATION/RECLASSIFICATION.................44.1CompatibilitywithPb-FreeAssemblyRework....44.2Reclassification.......................................................55PROCEDURE............................................................55.1SampleRequirements............................................55.1.1Reclassification(qualifiedpackagewithoutadditionalreliabilitytesting)..................................55.1.2Classification/ReclassificationandRework...........55.2InitialElectricalTest..............................................65.3InitialInspection....................................................65.4Bake........................................................................65.5MoistureSoak........................................................65.6Reflow....................................................................75.7FinalExternalVisual.............................................75.8FinalElectricalTest...............................................75.9FinalAcousticMicroscopy....................................76CRITERIA..................................................................86.1FailureCriteria.......................................................86.2CriteriaRequiringFurtherEvaluation...................96.2.1Delamination..........................................................96.3FailureVerification...............................................107MOISTURE/REFLOWSENSITIVITYCLASSIFICATION...................................................108OPTIONALWEIGHTGAIN/LOSSANALYSIS.......108.1WeightGain.........................................................108.2AbsorptionCurve.................................................108.2.1ReadPoints..........................................................108.2.2DryWeight...........................................................108.2.3MoistureSoak......................................................108.2.4Readouts...............................................................118.3DesorptionCurve.................................................118.3.1ReadPoints...........................................................118.3.2Baking...................................................................118.3.3Readouts...............................................................119ADDITIONSANDEXCEPTIONS............................11ANNEXAClassificationFlow..................................12ANNEXBMajorchangesfromRevisionCtoRevisionD................................................13FiguresFigure5-1ClassificationProfile............................................8TablesTable4-1SnPbEutecticProcess-ClassificationTemperatures(Tc)...............................................4Table4-2Pb-FreeProcess-ClassificationTemperatures(Tc)...............................................4Table5-1MoistureSensitivityLevels..................................6Table5-2ClassificationReflowProfiles..............................7March2008IPC/JEDECJ-STD-020D.1ivThisPageIntentionallyLeftBlankIPC/JEDECJ-STD-020D.1March2008vMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices1PURPOSEThepurposeofthisstandardistoidentifytheclassificationlevelofnonhermeticsolidstatesurfacemountdevices(SMDs)thataresensitivetomoisture-inducedstresssothattheycanbeproperlypackaged,stored,andhandledtoavoiddamageduringassemblysolderreflowattachmentand/orrepairoperations.Thisstandardmaybeusedtodeterminewhatclassification/preconditioninglevelshouldbeusedforSMDpackagequalifi-cation.Passingthecriteriainthistestmethodisnotsufficientbyitselftoprovideassuranceoflong-termreliability.1.1ScopeThisclassificationprocedureappliestoallnonhermeticsolidstateSurfaceMountDevices(SMDs)inpackages,which,becauseofabsorbedmoisture,couldbesensitivetodamageduringsolderreflow.ThetermSMDasusedinthisdocumentmeansplasticencapsulatedsurfacemountpackagesandotherpackagesmadewithmoisture-permeablematerials.ThecategoriesareintendedtobeusedbySMDproducerstoinformusers(boardassemblyoperations)ofthelevelofmois-turesensitivityoftheirproductdevices,andbyboardassemblyoperationstoensurethatproperhandlingprecautionsareappliedtomoisture/reflowsensitivedevices.IfnomajorchangeshavebeenmadetoapreviouslyqualifiedSMDpackage,thismethodmaybeusedforreclassificationaccordingto4.2.Thisstandardcannotaddressallofthepossiblecomponent,boardassemblyandproductdesigncombinations.However,thestandarddoesprovideatestmethodandcriteriaforcommonlyusedtechnologies.Whereuncommonorspecializedcompo-nentsortechnologiesarenecessary,thedevelopmentshouldincludecustomer/manufacturerinvolvementandthecriteriashouldincludeanagreeddefinitionofproductacceptance.SMDpackagesclassifiedtoagivenmoisturesensitivitylevelbyusingProceduresorCriteriadefinedwithinanypreviousversionofJ-STD-020,JESD22-A112(rescinded),orIPC-SM-786(rescinded)donotneedtobereclassifiedtothecurrentrevisionunlessachangeinclassificationlevelorahigherpeakclassificationtemperatureisdesired.AnnexBprovidesanoverviewofmajorchangesfromRevisionCtoRevisionDofthisdocument.Note:Iftheproceduresinthisdocumentareusedonpackageddevicesthatarenotincludedinthisspecification’sscope,thefailurecriteriaforsuchpackagesmustbeagreeduponbythedevicesupplierandtheirenduser.1.2BackgroundThevaporpressureofmoistureinsideanonhermeticpackageincreasesgreatlywhenthepackageisexposedtothehightemperatureofsolderreflow.Undercertainconditions,thispressurecancauseinternaldelaminationofthepackagingmaterialsfromthedieand/orleadframe/substrate,internalcracksthatdonotextendtotheoutsideofthepackage,bonddamage,wirenecking,bondlifting,dielifting,thinfilmcracking,orcrateringbeneaththebonds.Inthemostseverecase,thestresscanresultinexternalpackagecracks.Thisiscommonlyreferredtoasthe‘‘popcorn’’phenomenonbecausetheinternalstresscausesthepackagetobulgeandthencrackwithanaudible‘‘pop.’’SMDsaremoresusceptibletothisproblemthanthrough-holepartsbecausetheyareexposedtohighertemperaturesduringreflowsoldering.Therea-sonforthisisthatthesolderingoperationmustoccuronthesamesideoftheboardastheSMDdevice.Forwave-solderedthrough-holedevices,thesolderingoperationoccursundertheboardthatshieldsthedevicesfromthehotsolder.Through-holedevicesthataresolderedusingintrusivesolderingor‘‘pininpaste’’processesmayexperiencethesametypeofmoisture-inducedfailuresasSMTdevices.1.3TermsandDefinitionsacceleratedequivalentsoak–Asoakatahighertemperatureforashortertime(comparedtothestandardsoak),toprovideroughlythesameamountofmoistureabsorption.Seealsosoak.acousticmicroscope–Equipmentthatcreatesanimageusingultrasoundtoviewaspecimen’ssurfaceorsubsurfacefea-tures,includingdefectsanddamage.SeeJ-STD-035formoreinformation.areaarraypackage–Apackagethathasterminationsarrangedinagridonthebottomofthepackageandcontainedwithinthepackageoutline.March2008IPC/JEDECJ-STD-020D.11classificationtemperature(Tc)–ThemaximumbodytemperatureatwhichthecomponentmanufacturerguaranteesthecomponentMSLasnotedonthecautionand/orbarcodelabelperJ-STD-033.crack–Aseparationwithinabulkmaterial.SeealsoDelamination.damageresponse–Allirreversiblechangescausedbyexposuretoareflowsolderingprofile.dead-bug(orientation)–Theorientationofthepackagewiththeterminalsfacingup.delamination–Aninterfacialseparationbetweentwomaterialsintendedtobebonded.Seealsocrack.downbondarea–Anareaforawirebondonthediepaddle,whosedimensionsequalthoseofasinglebondpadonthedie.floorlife–Theallowabletimeperiodafterremovalfromamoisturebarrierbag,drystorageordrybakeandbeforethesolderreflowprocess.fullbodyhotairrework–Theprocessofheatingapackagebydirectingheatedgasatthepackagebodyinordertomeltonlythatpackage’ssolderconnections.live-bug(orientation)–Theorientationofthepackagewhenrestingonitsterminals.manufacturer’sexposuretime(MET)–Themaximumcumulativetimeafterbakethatcomponentsmaybeexposedtoambientconditionspriortoshipmenttotheenduser.moisture/reflowsensitivityclassification–Thecharacterizationofacomponent’ssusceptibilitytodamageduetoabsorbedmoisturewhensubjectedtoreflowsoldering.moisturesensitivitylevel(MSL)–Aratingindicatingacomponent’ssusceptibilitytodamageduetoabsorbedmoisturewhensubjectedtoreflowsoldering.packagethickness–Thecomponentthicknessexcludingexternalterminals(balls,bumps,lands,leads)and/ornonintegralheatsinks.peakpackagebodytemperature(Tp)–ThehighesttemperaturethatanindividualpackagebodyreachesduringMSLclas-sification.reclassification–Theprocessofassigninganewmoisturesensitivityleveltoapreviouslyclassifieddevice.soak–Theexposureofacomponentforaspecifiedtimeataspecifiedtemperatureandhumidity.Seealsoacceleratedequivalentsoak.wire-bondsurface–Theareawherewirebondsaretypicallyplaced.2APPLICABLEDOCUMENTS2.1JEDEC1JEP-140BeadedThermocoupleTemperatureMeasurementofSemiconductorPackagesJESD22-A120TestMethodfortheMeasurementofMoistureDiffusivityandWaterSolubilityinOrganicMaterialsUsedinIntegratedCircuitsJESD22-A113PreconditioningProceduresofPlasticSurfaceMountDevicesPriortoReliabilityTestingJESD22-B101ExternalVisualJESD22-B108CoplanarityTestforSurface-MountSemiconductorDevicesJESD22-B112HighTemperaturePackageWarpageMeasurementMethodologyJESD-47StressTestDrivenQualificationSpecification1.www.jedec.orgIPC/JEDECJ-STD-020D.1March20082JESD-625RequirementsforHandlingElectrostaticDischargeSensitive(ESD)Devices2.2IPC2IPC-TM-650TestMethodsManual32.1.1Microsectioning2.1.1.2Microsectioning-SemiorAutomaticTechniqueMicrosectionEquipment2.3JointIndustryStandards4J-STD-033StandardforHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesJ-STD-035AcousticMicroscopyforNonhermeticEncapsulatedElectronicComponents3APPARATUS3.1TemperatureHumidityChambersMoisturechamber(s),capableofoperatingat85°C/85%RH,85°C/60%RH,60°C/60%RH,and30°C/60%RH.Withinthechamberworkingarea,temperaturetolerancemustbe±2°CandtheRHtolerancemustbe±3%RH.3.2SolderReflowEquipment3.2.1FullConvection(Preferred)Fullconvectionreflowsystemcapableofmaintainingthereflowprofilesrequiredbythisstandard.3.2.2InfraredInfrared(IR)/convectionsolderreflowequipmentcapableofmaintainingthereflowprofilesrequiredbythisstandard.ItisrequiredthatthisequipmentuseIRtoheatonlytheairandnotdirectlyimpingeupontheSMDPackages/devicesundertest.Note:Themoisturesensitivityclassificationtestresultsaredependentuponthepackagebodytemperature(ratherthanthemountingsubstrateand/orpackageterminaltemperature).3.3OvensBakeovencapableofoperatingat125+5/-0°C.3.4Microscopes3.4.1OpticalMicroscopeOpticalMicroscope(40Xforexternaland100Xforcross-sectionexam,highermagnificationmightberequiredforverification).3.4.2AcousticMicroscopeTypicallyascanningacousticmicroscopewithC-ModeandThroughTransmissioncapability.Itshouldbecapableofmeasuringaminimumdelaminationof5%oftheareabeingevaluated.Note1:Theacousticmicroscopeisusedtodetectcrackinganddelamination.However,thepresenceofdelaminationdoesnotnecessarilyindicateapendingreliabilityproblem.Thereliabilityimpactofdelaminationmustbeestablishedforapar-ticulardie/packagesystem.Note2:RefertoIPC/JEDECJ-STD-035foroperationoftheacousticmicroscope.3.5Cross-SectioningMicrosectioningequipmentasrecommendedperIPC-TM-650,Methods2.1.1and2.1.1.2,orotherapplicabledocument.2.www.ipc.org3.CurrentandrevisedIPCTestMethodsareavailableontheIPCwebsite(www.ipc.org/html/testmethods.htm).4.www.ipc.orgMarch2008IPC/JEDECJ-STD-020D.133.6ElectricalTestElectricaltestequipmentwithcapabilitiestoperformappropriatetestingondevices.3.7WeighingApparatus(Optional)Apparatuscapableofweighingthepackagetoaresolutionof1microgram.Thisapparatusmustbemaintainedinadraft-freeenvironment,suchasacabinet.Itisusedtoobtainabsorptionanddesorptiondataonthedevicesundertest(seeClause8).3.8BeadedThermocoupleTemperatureMeasurementRefertoJEP140forguidanceonprocedurestoaccuratelyandconsistentlymeasurethetemperatureofcomponentsduringexposuretothermalexcursions.JEP140guidelineapplicationscaninclude,butisnotlimitedto,temperatureprofilemeasurementinreliabilitytestchambersandsolderreflowoperationsthatareassociatedwithcomponentassemblytoprintedwiringboards(PWBs).4CLASSIFICATION/RECLASSIFICATIONReferto4.2forguidanceonreclassificationofpreviouslyqualified/classifiedSMDs.Engineeringstudieshaveshownthatthin,smallvolumeSMDpackagesreachhigherbodytemperaturesduringreflowsol-deringtoboardsthathavebeenprofiledforlargerpackages.Therefore,technicaland/orbusinessissuesnormallyrequirethin,smallvolumeSMDpackages(referenceTables4-1and4-2)tobeclassifiedathigherreflowtemperatures.Toaccu-ratelymeasureactualpeakpackagebodytemperaturesrefertoJEP140forrecommendedthermocoupleuse.Note1:PreviouslyclassifiedSMDsshouldonlybereclassifiedbythemanufacturer.Usersshouldrefertothe‘‘MoistureSensitivity’’labelonthebagtodetermineatwhichreflowtemperaturetheSMDpackageswereclassified.Note2:Unlesslabeledotherwise,level1SMDpackagesareconsideredtobeclassifiedat220°C.Note3:Ifsupplieranduseragree,componentscanbeclassifiedattemperaturesotherthanthoseinTables4-1and4-2.4.1CompatibilitywithPb-FreeAssemblyReworkPb-freeareaarraycomponents(classifiedperTable4.2)shouldbecapableofassemblyreworkat260°Cwithin8hoursofremovalfromdrystorageorbake,perJ-STD-033.Componentsthatdonotmeetthisassemblyreworkrequirementorthatthesupplierdoesnotsupport260°Creworkshallbesospeci-fiedbythecomponentmanufacturer.Toverifythiscapabilityforcomponentsclassifiedatatemperaturebelow260°C,asampleofthesizeper5.1.2shallbesoakedperlevel6conditions(seeTable5-1)usingatimeonlabel(TOL)of8hours,andsubjectedtoasinglereflowcyclewithTpofnotlessthan260°C.Alldevicesinthesampleshallpasselectricaltestandhaveadamageresponse(per6.1and6.2)notgreaterthanthatobservedforthesamepackageatitsratedMSLlevel.Reworkcompatibilityverificationisnotrequiredforareaarraycomponentsratedat260°Corperipheralleadedmetalleadframepackagesthatdonotrequirefullbodyhotairrework.Table4-1SnPbEutecticProcess-ClassificationTemperatures(Tc)PackageThicknessVolumemm3<350Volumemm3≥350<2.5mm235°C220°C≥2.5mm220°C220°CTable4-2Pb-FreeProcess-ClassificationTemperatures(Tc)PackageThicknessVolumemm3<350Volumemm3350-2000Volumemm3>2000<1.6mm260°C260°C260°C1.6mm-2.5mm260°C250°C245°C>2.5mm250°C245°C245°CNote1:Atthediscretionofthedevicemanufacturer,butnottheboardassembler/user,themaximumpeakpackagebodytemperature(Tp)canexceedthevaluesspecifiedinTables4-1or4-2.TheuseofahigherTpdoesnotchangetheclassificationtemperature(Tc).Note2:Packagevolumeexcludesexternalterminals(e.g.,balls,bumps,lands,leads)and/ornonintegralheatsinks.Note3:Themaximumcomponenttemperaturereachedduringreflowdependsonpackagethicknessandvolume.Theuseofconvectionreflowprocessesreducesthethermalgradientsbetweenpackages.However,thermalgradientsduetodifferencesinthermalmassofSMDpackagesmaystillexist.Note4:MoisturesensitivitylevelsofcomponentsintendedforuseinaPb-freeassemblyprocessshallbeevaluatedusingthePb-freeclassificationtemperaturesandprofilesdefinedinTables4.2and5-2,whetherornotPb-free.Note5:SMDpackagesclassifiedtoagivenmoisturesensitivitylevelbyusingProceduresorCriteriadefinedwithinanypreviousversionofJ-STD-020,JESD22-A112(rescinded),IPC-SM-786(rescinded)donotneedtobereclassifiedtothecurrentrevisionunlessachangeinclassificationlevelorahigherpeakclassificationtemperatureisdesired.IPC/JEDECJ-STD-020D.1March200844.2ReclassificationSMDpackagespreviouslyclassifiedtoamoisturesensitivitylevelandclassificationtemperature(Tc)maybereclassifiedifthedamageresponse(e.g.,delamination/cracking)atthemoresevereconditionforitemslistedin6.1and6.2islessthan,orequalto,thedamageresponseattheoriginalclassificationcondition.IfnomajorchangeshavebeenmadetoapreviouslyqualifiedSMDpackage,thismethodmaybeusedforreclass