150KHz至1GHz电磁耐受力量测－第3部(1020606江传)

150KHz至1GHz电磁耐受力量测－第3部(1020606江传) 草-制1020385 ICS ,1, 中華民國國家標總號 積體電路,150KHz至1GHz電磁耐受 準 力量測,第3部,大電流注入法(BCI) 類號 CNS Integrated Circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz – Part 3: Bulk current injection (BCI) method 編訂說明,本案建議案號為「建-制1020259」,草案編號為「草-制1020385」,係由林漢 年委員編擬,依程序辦理徵求意見,敬請 惠賜卓見。 目錄 節次 頁次 前言........................................................................................................................................ 3 1. 範圍 ................................................................................................................................... 4 2. 引用標準 ........................................................................................................................... 4 3. 名詞(術語)與定義 ............................................................................................................. 4 4. 通則 ................................................................................................................................... 4 5. 測試條件 ........................................................................................................................... 8 5.1 通則 ................................................................................................................................. 8 5.2 測試設備 ......................................................................................................................... 9 5.3 測試板 ........................................................................................................................... 11 6. 測試程序 ......................................................................................................................... 13 6.1 有害的電磁場 ............................................................................................................... 13 6.2 順向功率限制的校正 ................................................................................................... 13 6.3 大電流注入測試 ........................................................................................................... 16 附錄A(參考)測試位準與頻率步階之範例........................................................................ 21 (共28頁) 公布日期 修訂公布日期 經濟部標準檢驗局印行 年月日 年月日 印行年月年月 本標準非經本局同意不得翻印 ※ CNS ,2, 附錄B(參考) BCI測試板與設置之範例 ........................................................................... 25 附錄C(參考)射頻測試板範例與設置................................................................................ 31 參考目錄.............................................................................................................................. 33 CNS ,3, 前言 本標準係依標準法之規定 CNS ,4, 1.Scope and object 1. 範圍 This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. IEC 62132在這一部分是在描述大電流注入測試法(BCI),用於量測在出現有傳導性射頻擾 動之下的IC (Integrated Circuit,積體電路)之耐受性,如射頻輻射造成之擾動。這個 只適用於連接板外導線之IC,如進入電纜線束內。這個測試法可注入射頻電流於單一或 是一組之電纜線。 This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals. 此標準制定了一個共同的基礎,用以評估一個存在於不想要的射頻電磁信號環境下的半 導體元件。 2.Normative references 2. 引用標準 The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. 對應用本標準而言下列參考標準相當重要。就有日期的規範而言,只有此版適用。無日 期之規範,則以最新版之參考標準(包括任何修訂)方可適用。 IEC 62132-1:2006, Integrated circuits – Measurement of electromagnetic immunity,150 kHz to 1 GHz – Part 1: General conditions and definitions IEC 62132-1:2006積體電路?150 kHz至1 GHz之電磁耐受性量測–第1部,通則狀況及定義。 3.Terms and definitions 3. 名詞(術語)與定義 For the purposes of this document, the terms and definitions given in IEC 62132-1 apply. 針對此文件所使用的名詞及定義都已經標註在IEC 62132第1部,。 4.General 4. 通則 The characterization of RF immunity (or susceptibility) of an integrated circuit (IC) is essential to define the optimum design of a printed circuit board, filter concepts and for CNS ,5, further integration into an electronic system. This document defines a method for measuring the immunity of ICs to RF current induced by electromagnetic disturbance. 在定義印刷電路板或濾波器設計最佳化時或者更進一步整合於電子系統時,其IC的射頻 耐受性(或稱敏感度)特性是重要的。此標準制訂了一個方法,量測IC受電流引起之電磁 擾動的耐受性。 This method is based on the bulk current injection (BCI) method used for equipment and systems [1, 2, 3]. The BCI method simulates the induced current as a result of direct radiated RE signals coupled onto the wires and cables of equipment and systems. 這個量測方法是根據設備或系統[參考目錄1、2、3]的大電流注入法(BCI)。大電流注入法 (BCI)係模擬透過輻射之射頻信號經由耦合至設備和系統的導線或電纜線上的感應電流。 In general, in electronic systems, off-board wire connections or traces on the printed circuit board act as antennas for electromagnetic fields. Via this coupling path, these electro,magnetic fields will induce voltages and currents at the pins of the IC and may cause interference. ICs are often used in various configurations dependent on their application. In this case, immunity levels of electronic equipment are closely linked to the ability of an IC to withstand the effects of an electromagnetic field represented. 一般在電子系統上,對於電磁場而言,板外連接線或印刷電路板上之走線如同天線。透 過此種耦合路徑,這些電磁場會在IC的導腳上感應生成電壓和電流,並且有可能造成干 擾。IC根據其應用而處於各種配置環境之中,在這種情況之下,電子設備的耐受層級與 IC能夠承受之電磁場的能力有著密切的相關性。 To characterize the RF immunity of an IC, the induced current level necessary to cause the IC’s malfunction is measured. The malfunction may be classified from A to E according to the performance classes defined in IEC 62132-1. 為了將 IC的射頻耐受性特性化,需要量測導致IC誤動作的感應電流位準。然而,根據 IEC 62132-1之定義其誤動作程度可區分成A至E等級。 A principal set-up for the bulk current injection method is presented in Figure.1 大電流注入量測法的主要配置如圖1所示 CNS ,6, Figure 1 – Principal current path when using BCI CNS ,7, 電流監測端 電流探棒 功率注入端 待測IC 待測裝置 注入探端 干擾電流 控制與監測IC 輔助電路 與 旁路電容 地 圖1 使用大電流注入量測法(BCI)時的主要電流路徑 Two electrically shielded magnetic probes are clamped on one wires or a combination of wires that is/are connected to the device under test. The first probe is for the injection of RF power that induces I onto the wires. The second probe is used for monitoring disturbance the induced current on those wires. 兩個具有屏蔽電性的磁場探棒夾在連接至待測設備的一條導線上或一組線束上。第1個 探棒是為注入感應擾動電流的射頻功率至導線。第2個探棒是用來監測這些電纜線上的 感應電流。 The disturbance current flows in a loop comprising: wire(s), the selected IC’s pin(s), Vss terminal, ground path and supportive circuitry. This supportive circuit provides the IC functional elements as source and/or load(s). The supportive circuitry is directly connected to the IC. When the equivalent RF impedance of the supportive circuitry is larger than 50Ω, then a by-pass capacitor is recommended. The by-pass capacitor, to be used at the supportive circuitry side, may also be needed to confine the loop area in which the induced current will be flowing. By default, the lumped by-pass capacitor of 1 nF shall be used. It represents the capacitance from the wire onto a cable harness or chassis. Deviation from using this bypass capacitor (e.g. as functional performance becomes affected) shall be given in the test report. 擾動電流流經一個迴路,其包含,導線、IC的導腳、負端電壓終端、接地路徑以及輔助 電路(supportive circuitry)。這個輔助電路提供IC之電源與(或)負載的功能。這個輔助電 路直接連結至IC。當輔助電路的等效射頻阻抗大於50Ω時,則需要使用旁路電容。旁路 電容用於輔助電路側,也可限制於感應電流流經的迴路區域。預設情況下,應該使用1 nF 的集成旁路電容。它代了導線至電纜線或機殼之電容。由於旁路電容造成的誤差應該 CNS ,8, 在測試報告中給予註明 (例如,功用效能受到影響)。 The by-pass Capacitor may be supplemented with optional decoupling network, see Figure 2, to achieve the required attenuation towards the supportive circuitry. The decoupling impedance is determined by the RF immunity of the supportive circuitry. It shall not adversely affect the response of the device under test, i.e. the result of the test. 旁路電容可以用選配的網路代表,見圖2,以達到對輔助電路要求的衰減量。輔助電路 的射頻耐受性決定了去耦合阻抗,它應該不能影響到待測設備的反應,即是檢測結果。 The disturbance current Idisturbance induced into the wire(s) flows through the IC and may create a failure in the device’s operation. This failure is defined by parameters called the immunity acceptance criteria, which are checked by a controlling and monitoring system. 感應至電纜線上的擾動電流流過IC並且可能造成設備的故障。此種故障是以一種稱作耐 受性忍受標準的參數所訂定,並且透過控制與監測系統做確認。 5.Test conditions 5. 測試條件 5.1General 5.1 通則 The general test conditions are described in the IEC 62132-1. 一般測試條件已被描述於IEC 62132-1。 During the immunity tests, either a continuous wave (CW) or an amplitude modulated (AM) RF signal shall be used as the disturbance signal. The device under test (DUT) shall be exposed at each frequency for sufficient dwell time. By default, an amplitude modulated RF signal using 1 kHz sinusoidal signal with a modulation index of 80 % is recommended for testing. 在耐受性測試中,擾動信號應使用連續波(CW)或振幅調變(AM)的射頻信號。待測設備 (DUT)應該籠罩於各個頻率並且足夠的駐留時間。預設情況下,建議使用80%調變指數 的1 kHz正弦信號之振幅調變射頻訊號予測試。 When an AM signal is used, the peak power shall be the same as for CW, see lEC 62132-1. When other modulation schemes are used, they shall be noted in the EMC IC test report. 當振幅調變信號被使用時,其峰值功率應與連續波相同,見於IEC 62132-1。使用其他 的調變方式,則應備註於EMC的IC測試報告內。 The levels of disturbance current required to test the IC’s immunity depend on the application environment. Table A.1 in Annex A gives some examples of typical values for disturbance current injection. CNS ,9, IC耐受性測試的擾動電流層級需依據其應用環境而定。於附錄A之表A.1提供一些關 於擾動電流注入之典型數值的範例。 NOTE : Where required by the customer, to satisfy high test levels, additional protection components could be used to permit high current injection. All other pins must be left loaded according to 6.4 of IEC 62132-1. 備考, 為了滿足客戶要求更高位準的測試需求,在高電流注入時允許使用保護元件。 依據IEC 62132-1 6.4其餘的接腳必須保持加載狀態。 5.2 Test equipment 5.2 測試設備 The test equipment comprises the following equipment and facilities: ? ground reference plane; ? current injection probe(s); ? current measurement probe(s); ? RF signal generator with AM and CW capability; ? RF power amplifier(s). A minimum 50 Watt RF power amplifier is recommended; ? RF wattmeter or equivalent instrument, to measure the forward (and reflected) power; ? RF voltmeter or equivalent instrument which, together with the current measurement probe measures the disturbance current induced; ? directional coupler; ? DUT monitoring equipment (optional: optical interface(s)). A schematic diagram of the test set-up is shown in Figure 2. 此測試設備由以下的設備與設施組成, ? 參考接地面, ? 電流注入探棒, ? 電流量測探棒, ? 具有振幅調變與連續波功能之射頻信號產生器, ? 射頻功率放大器,建議為最小為50 W之射頻功率放大器, ? 射頻瓦特計或是等效儀器,用以量測其順向(或反向)功率, ? 射頻伏特計或是等效儀器,與電流量測探棒一起測量感應擾動電流, ? 方向耦合器, ? 監測待測物之設備(選配,光纖介面), 測試設置示意圖如圖2。 CNS ,10, Figure 2 – Schematic diagram of BCI test set-up 射頻瓦特計 方向耦合器 射頻伏特計 射頻放大器 射頻產生器 (選配) 待測 注入探棒 去耦合電路 量測探棒 裝置 VSS輔助電路 (預設) 去耦合電容 參考接地面 圖2 大電流注入法配置示意圖 An injection probe or set of probes capable of operating over the test frequency range is required to couple the disturbance signal into the connecting lines of the DUT. The injection probe is a transformer. 需要一個或一組可操作於測試頻率範圍的探棒,用於將擾動信號耦合至連接於待測物 的電纜線上。注入探棒係為一轉換器。 NOTE An optical interface can be used for monitoring the DUT response against the immunity criteria given. Use of optical interface is not mandatory but recommended. 備考, 對於給定之耐受性準則,可使用光纖介面監測待測物響應。使用光纖介面並不 是強制性的,但是建議使用。 CNS ,11, 5.3 Test board 5.3 測試板 An example of a BCI test board is shown in Figure 3. This example of the BCI test board has an opening in the middle to accommodate the two current probes. 大電流注入法之測試板的範例如圖三所示。這個大電流注入法之測試板的範例在中間 留有一個開口,用來容納兩個電流探棒。 The standard test board as defined in IEC 62132-1 needs to be modified to fulfil the BCI test condition requirements. If the standard test board is used, a low impedance ground connection between standard test board and the BCI test board shall be made. Gasket, contact springs or multiple screws shall be used to contact the BCI test board to the BCI test fixture support at the inner hole when the GRP is not included with the BCI test board layer stack-up. 定義於IEC 62132-1的標準測試板需要修改,以滿足大電流注入法測試條件的要求。如 果使用標準測試板,在標準測試板與大電流注入法測試板之間應該會以低阻抗的接地 連接。當接地參考平面(GRP)不包括於大電流注入法測試板的堆疊層時,應使用墊片、 接觸彈片和螺絲來連結大電流注入法測試板至大電流注入法治具之內孔處的支撐物。 Figure 3 – Example test board, top view CNS ,12, 電源供給 控制 輸入/ 輸出 導線 測試 輔助電路 量測探棒 待測裝置 注入探棒 標準測試板 大電流注入法測板 圖3 測試板範例?俯視圖 The wire(s) to which the current is injected to is/are connected at one end to the selected IC pin(s) and on the other end connected to the support circuitry. The support circuitry may comprise a load, a supply or a signal source necessary to operate the device under test as intended. 被電流注入的導線一端是被連接到選定的IC接腳然而另一端連接到輔助電路。輔助電 路可包含負載和意圖用以操作待測裝置的電源或信號源。 The BCI test board has the advantage of fixing the position of the probes resulting in a more reproducible measurement. The size of the holes and the injection wire length should be at least designed to the size of the probes used. The hole shall exceed the size of the probes on all sides by at least 10 mm, with a maximum of 30 mm. In general, the wire length shall be limited to a quarter of a wavelength at the maximum frequency used with the BCI test method (? 75 mm in air at 1 GHz). 大電流注入法測試板有個優點是能固定探棒的位置,因此能有更好的量測重複性。孔 徑的大小與注入線的長度應設計成可被探棒使用之最小規格。其孔徑大小應該超過探 棒四周至少10 mm,但最大為30 mm。在一般情況下,導線長度應限制在使用大電流注 入法之最高頻率的四分之一波長以下。(在大氣中1 GHz時約為75 mm。) The BCI test board is placed on a copper test fixture connected to the ground reference plane (GRP), shown in Annex C. Size of GRP is typically table top size extended to a minimum of 0.1 m beyond the footprint of the test fixture. The copper test fixture needs CNS ,13, to be high enough to allow the injection probe-carrying fixture. 大電流注入測試板是放置於銅質測試治具上並連接於參考接地面(GRP),詳見於附錄 C。參考接地面的大小通常會比測試治具佈印圖(footprint)超出至少0.1m以外。銅質治 具需要有足夠的高度以容納注入探棒之治具。 NOTE 1: The GRP may also be incorporated in one of the BCI test board copper layers. In this case, the copper test fixture support is no longer necessary. 備考1. 參考接地面是結合在大電流注入測試板內的某一銅層,在這一種情況之下,就 不需要銅質治具了。 The shield of the injection probe and the measurement probe shall be grounded with a short connection underneath the copper test fixture to the GRP. 注入探棒與量測探棒的屏蔽應與銅質治具下的參考接地面作接地。 NOTE 2: Coaxial feed-through connectors can be mounted through the GRP (underneath the copper test fixture) to be connected to the current injection and measurement probes directly. 備考2. 同軸饋穿(feed-through)連接器可以安裝於參考接地面上(在銅質治具之下),直 接連接到電流注入探棒與量測探棒。 6. Test procedure 6. 測試程序 6.1 Hazardous electromagnetic fields 6.1 有害的電磁場 RF fields may exist within the test area. Care shall be taken to ensure that the requirements for limiting the exposure of human to RF energy are met. It is preferable to perform the RF immunity test in an enclosure providing sufficient RF shielding 射頻場可能存在於試驗區。應小心確保規定符合有關限制人類暴露於射頻的能量。最 好在提供良好射頻的屏蔽中執行射頻耐受性測試。 6.2 Calibration of forward power limitation 6.2 順向功率限制的校正 The required forward RF power from the RF generator and RF amplifier is determined in the BCI test set-up calibration procedure of the injection probe. In this process the level of forward RF power (in CW mode) supplied to the injection probe is established, which is necessary to generate the desired current ‘disturbance 需要由射頻產生器和射頻放大器提供的順向射頻功率是由注入端探棒的大電流注入法 測試設置校正程序決定。在這個過程中建立了供給注入端順向射頻功率的位準(在連續 CNS ,14, 波模式),這是產生所需的擾動電流所必要的。 Calibration is performed in the calibration fixture, composed of an electrically short section of a transmission line. The short section permits the measurement of current in the central conductor of the line, while the current injection probe is clamped around the central conductor. The output terminals of the fixture are terminated with a 50Ω load each with minimum of 0.5 W power dissipation, spectrum analyser or RF voltmeter. Measurement of the voltage established across the 50Ω input impedance of RF receiver permits the calculation of current flowing in the central conductor. 校正是在校正治具中執行,治具是由一段小電氣長度之傳輸線組成。該段短傳輸線允 許電流量測在線導體中央。而電流注入探棒被箝在導體中心。在治具的輸出終端有一 個至少能耗散0.5 W功率的50Ω負載,頻譜儀或射頻伏特計。跨過射頻接收器50Ω 阻抗的輸入端量測電壓,允許計算中央導體電流。 The calibration procedure shall be as follows. 校正程序應如下 (a) The injection probe shall be clamped in the calibration fixture as shown in Figure 6. Fix the probe in the central position, equidistant from either end of the fixture walls. (a) 注入探棒應在校正治具上夾緊,如圖6。探棒固定在距離治具兩端相等的中央位置。 The calibration fixture will be terminated by a 50Ω RF load at one end and a 50Ω RF receiver (spectrum analyser, voltmeter, etc.) at the other, with an attenuator if necessary. Caution: use a load with an adequate power rating. 校正治具由50Ω負載的終接其中一端,而另一端則以50Ω的射頻接收機(頻譜分析儀、 伏特計等)予以終接,另一方面,如果有必要需加一個衰減器。注意,使用具合適額定 功率的負載。 NOTE: Lower power ratings can be used during calibration assuming that the system behaves linearly. 備考,假設系統為線性,校正時可使用較低的額定功率。 b) Connect the components of test equipment as shown in Figure 4. (b) 連接測試設備組件如圖四。 c) Increase the amplitude of the test signal to the injection probe until the required current level, as measured by the RF receiver, is reached. (c) 增加注入探棒測試訊號的振幅,直到達到射頻接收機量測所需的電流大小。 Record the forward RF power necessary to generate the desired current Idisturbance. CNS ,15, This forward RF power is admitted as the maximum forward power limit, Plimit。 (d) 記錄產生擾動電流Idisturbance所需的順向射頻發射功率。此順向射頻功率將視為 最大順向功率Plimit的限制。 e) Repeat steps d) to e) for each frequency step within the specified frequency range. (e) 指定的頻率範圍內每個頻率間隔重複步驟(d)至(e)。 注入探棒 衺減器+ 負載50Ω 接收機50Ω 方向耦合器 瓦特計 射頻產生器 放大器 圖4 校準設置 CNS ,16, 6.3 BCI test 6.3 大電流注入測試 For the RF immunity tests, a substitution method with power and current limitation is used, which allows keeping track of RF power and RF current up to the limits. Substitution method is well adapted in this IC immunity test method and related to the ISO method. 對射頻耐受性測試,有一個替代的方法是使用功率和電流限制。允許保持平台的射頻 功率和射頻電流到達極限。替代方法能適用於IC耐受性測試及相關的ISO方法中。 ? Connect the current probes, other test equipment and test board. ? 連接電流探棒, 其他測試設備和測試板。 ? Supply the DUT and check for a proper operation. ? 提供待測物和檢查是否有正常運作。 ? For each test frequency, increase the amplitude of the signal gradually to the injection probe until target test current limit level for Idisturbance reached as indicated by monitoring the output of the measurement current probe, or ? 對於每個測試頻率,逐步提高注入探棒信號的振幅直到測試目標擾動電流位準達到 電流探棒量測輸出端的指示點或 ? the calibrated maximum forward power Plimit supplied to the injection probe is reached.Also in this case, although the injected current level is not reached, the maximum current level is recorded, or ? 達到注入探棒的最大順向功率提供校正最大功率。另外,在這種情況下,雖然注入 電流位準沒有達到目前被記錄的最高電流位準,或 ? the RF immunity level of the IC is found. If a failure of IC occurs or the limit for Idisturbance is met or Plimit target level is reached, in all cases the monitored current and the forward power are recorded. ? IC已知的射頻耐受性位準被發現。如果有IC故障發生或達到擾動電流極限或達到 最大功率,在這些情況下,都必須記錄監測電流和順向功率。 NOTE1 : For the purpose of investigation, the details regarding the RF immunity determination could be recorded too 備考1.為調查目的,關於射頻免疫的細節有關決定也可以被記錄。 NOTE2 : Assuming no glitches are generated during frequency transitions, the RF amplitude at the next frequency may be chosen e.g. 10 dB less than the previous level (taken into account the frequency dependency of the system) to speed up the test. 備考2. 頻率轉換過程中沒有錯誤產生,在下一個頻率的射頻振幅可以被選擇,例如低於 CNS ,17, 先前的位準10 dB(考慮到系統相關頻率)以加速測試。 Test procedure is depicted in detail in the flowchart given in Figure 5. That flowchart applies for only one frequency step 測試過程中詳細描述的圖在圖5,這流程圖適用於只有一個頻率步階。 Figure 5 — BCI test procedure flow chart for each frequency step CNS ,18, 開始 逐步增加 順向的功率 是 IC失效之出現? 否 PlimitI 否 否 smit 達到 達到 是 是 是 記錄量測的注入電流和順向功率 圖5 對每個頻率步階大電流注入法的測試程序流程圖 6.4 BCI test set-up characterization procedure 6.4 大電流注入設置的特性化程序 In order to validate the BCI test board impedance, a validation procedure is required. 為了驗證大電流注入法的測試板的阻抗,驗證過程是必需的。 For this validation, all components of the test set-up shall be used, except for the device under test. The port represented by the selected pin(s) under IC test is replaced with a 50Ω reference impedance. Figure 6 shows a schematic of the validation test set-up. 除了待測裝置外,所有被使用的測試設備元件都該被驗證。該埠代表被選擇接腳在IC 測試被一50Ω參考阻抗替代。圖六顯示了一個驗證測試設置示意圖。 CNS ,19, Figure 6 — Impedance validation test set-up 選配, 去耦網路 注入探棒 測試探棒 輔助電路 預設,旁路電容 大電流注入法測試板 圖6 阻抗驗證測試設置 During the validation over the whole frequency range, the value of injected current is fixed. A value of 10 mA for the disturbance current injected is recommended. For each frequency step, the RF forward power needed shall be noted 在認證整個頻帶範圍內,其電流注入值是固定的。建議一個值為10 mA注入電流的擾 動。對每一頻段,應記錄其所需射頻功率。 Test board validation could be characterized by transfer impedance defined with: 測試板的驗證可以通過轉移阻抗的特性定義, In cases involving use of several test boards, the Z(f) values should be the same. That allows comparison of IC immunity tests results done under the same conditions. 在使用不同的測試板時,阻抗值Z(f)應該是相同的。在相同條件下,IC耐受性測試結 果才可被比較。 6 Test report CNS ,20, 6 7. 測試報告 The test report shall be prepared in accordance with the requirements given in IEC 62132-1. 測試報告應按照62132-1(CNS_)標準給予。 Immunity acceptance criteria should be clearly described in the test report. The test board configuration should also be described in detail to reproduce the results. 測試報告應清楚地描述耐受性驗收標準。為了結果的再現性,測試板的配置也應該詳細 說明。 In all cases, such parameters as injected RF current Idisturbance, , the applied forward RF power Pforward , calibration power Plimit and the current Idisturbance , which are recorded during the calibration and measurement processes, shall be documented in the test report. 在所有情況下,諸如注入射頻電流Idisturbance、外加前置射頻功率Pforward和校正功 率Plimit等會被記錄在校正和量測過程中的參數,應該被記錄在測試報告。 Additional critical items such as test board description and value of by-pass capacitor (default) and decoupling (when used) should be listed in the test report. 其他重要項目,如測試板的描述和旁路電容值(預設值)和去耦合(使用時)應該被列在測試 報告中。 CNS ,21, Annex A 附錄A (Informative) (參考) Examples for test levels and frequency step selection 測試位準與頻率步階之範例 A.1 Typical values for current injection A.1 注入電流標準值 The test signals severity level is the test current of the calibrated test current applied. These test severity levels are expressed in terms of the equivalent RMS (root-mean-square) mA value of the unmodulated current signal. These test levels are taken from the requirements for module testing in automotive/avionic applications. The levels applied at IC testing shall be provided by the end-user and are determined by the criticality of the function(s) controlled. Other application environments require less stringent limits. 測試信號嚴酷位準是測試應用於校正測試的電流。這些測試嚴酷位準是以未調變電流 信號的等效RMS(均方根)mA值來表達。這些測詴位準被要求採取測詴汽車/航空 電子模組的應用。施加在IC測詴位準應由終端用戶所提供,並由關鍵性的操作 功能控制決定。其他應用環境要求較不需嚴格的限制。 Examples of severity levels are given in Table A.1.Levels of injected current are related to IC pin connection. Pins connected to external wiring could be tested with the highest current values, whereas pins with only local connections could be allowed to withstand the lower levels. Values should be clearly detailed in the IC test plan. 嚴酷位準的範例給於表A.1。注入電流位準與IC接腳的連接有相關。接腳連接至 外部接線可以施加最大的測詴電流值,而局部連接的接腳則僅能承受較低的位 準。測詴值應明確詳載在IC測詴計劃中。 Table A.1 - Test severity levels CNS ,22, 表A.1 測試嚴酷位準 電流(連續波) 測試靈敏度層級 没有插入損耗 ? 50 mA ? 100 mA ? 200 mA ? 300 mA ? 標準在用戶間議定的特定值 In case of use of additional protection components applied on the test board, in order to withstand higher current values, a description of this protection circuitry and its layout should be added in the IC test report. 在使用額外的保護元件於測詴板上使其能承受更高電流的情形下,此保護線路及 其佈局應加入IC的測詴報告中。 A.2 Frequency steps A.2 頻率步階 Injected current induced by electromagnetic disturbances on wire is obtained at discrete frequencies. The distance between 2 test frequencies is defined as the frequency step. 在離散的頻率上,注入的電流會在導線上引起電磁擾動。兩測詴頻率之間的差距 被定義為頻率步階。 The choice of the frequency steps should cover the whole immunity range of IC and avoid skipping frequencies on which an immunity problem may occur. In general, the root causes of IC disturbances are due to impedance resonances. These are often very narrow and the frequency step should take into account this phenomenon. 選擇的頻率步階應該包括IC整個耐受性範圍,避免略過耐受性頻率上可能會出 現的問題。在一般情況下,造成IC電路擾動的根本原因是阻抗共振,而這現象 通常發生在很小的頻率區間內,且應在規劃頻率步階時被考量在內。 There are 2 ways to define frequency steps: with a linear or a logarithmic approach. 有2種方式來定義的頻率步階:用線性或對數的方法。 An example of a linear frequency step (automotive and aerospace applications) is given in Table A.2. 表A.2是線性頻率步階(汽車和航空應用)的範例。 CNS ,23, CNS ,24, Table A.2 - Linear frequency step 表A2 線性頻率步階 頻寬 估量最大頻率的階級 2 KHz 10 KHz,100 KHz 20 KHz 100 KHz,1 MHz 200 KHz 1 MHz,10 MHz 2 MHz 10 MHz,100 MHz 5 MHz 100 MHz,1 GHz An example of a logarithmic frequency step (automotive applications) is given in Table A.3. 表A.3是對數頻率步階(汽車應用)的範例。 Table A.3 - Logarithmic frequency step 表A3 對數頻率步階 最小頻率 最大頻率 頻率階級 10 KHz 100 KHz 10 % 100 KHz 100 MHz 5 % 100 MHz 1 GHz 2 % CNS ,25, Annex B 附錄B (Informative) (參考) Example of BCI test board and set-up BCI測試板與設置之範例 The BCI test set-up presented in this example uses injection probes, e.g. model F140 from FCC. The probes shall be able to inject high current values with a frequency range of 100 kHz to I GHz. Probes associated to a small current probe, e.g. 94111 model, allow the needs of the test to be covered. 在這個範例中提出了大電流注入法測試設置中使用的注入探棒,例如FCC的F140模型。該 探棒將能夠注入的高電流值的頻率範圍為100 kHz至I GHz。關於小電流探棒,例如94111 模型,讓需要的測試包括在內。 Due to the size of the two probes, I I 0 mm wide for both, a test board with an opening of 120 mm to put the two probes is required to allow the probes used in the lower frequency range(< 500 MHz). Figure B.1 shows a general view of the test board. The recommended distance between probes is 10 mm. 由於兩個探棒的距離寬為110 mm,讓測試板開口為120 mm使兩個探棒可置入,要求讓探 棒在較低的頻率範圍(<500 MHz)。圖B.1中顯示測試板示意圖。推薦的探棒之間的距離為 10 mm。 Figure B.1 - General view CNS ,26, 瓦特計 功率放大器 射頻伏特計 光纖接口 方向耦合器 射頻產生器 故障檢測 測試探棒 注入探棒 輔助電路 待測IC 導線 測試板 圖B.1 測試板示意圖 A hole, typical size: 120 mm x 150 mm shall permit placement of the two probes used in the lower frequencies, when using conventional BCI probes. Distance between probes may be limited to 1 mm. 在使用傳統大電流注入法探棒應允許安置的兩個探棒在較低的頻率,其開口典型尺 寸,120 mm×150 mm。探棒之間的距離可能會限制為1 mm。 When smaller injection and measurement probes are used to enable testing up to higher frequencies, a metal plate shall cover this hole in the test board with a hole exceeding these probes by 10 mm on each side. This sub-board shall make firm electrical contact at each edge of the test board. 當較小的注入和測量探棒用於能使測試到更高的頻率,覆蓋的金屬板應在每邊孔與孔 測試板上超過這些探棒10 mm。這子板應會在每邊測試板作穩固的電接觸。 The position of the current measurement probe should be close to the IC, required length less than 20 mm, which permit to measure the current injected in the IC. In this case, it is more appropriate to measure the surface currents induced in the differential lines than to create a discontinuity in the differential transmission line path. The distance between probes should be limited to 1 mm. 電流量測探棒的位置應靠近IC,其距離至少需要小於20mm,以確保量測到的是注入IC 的電流。在這情況之下,比起在差模傳輸路徑上造成不連續,它更適合用於量測因表 面電流感應成的差模傳輸線。而其探棒間的距離應限制於1mm。 To minimize effects due to the test board, each side of the test board should be wide enough to be considered as a ground reference plane. Recommended size is minimum 30 mm, see Figure B.2. 由於測試板為了減少影響,每一側的測試板應寬足以被視為一個參考接地面。推薦大 CNS ,27, 小為至少30 mm,看圖B.2。 Figure B.2 - Example of top view of the test board 注入探棒 待測IC 輔助電路 電流探棒 旁路電容 圖B.2 測試板俯視之範例 The ground reference plane (GRP) is considered to be a solid ground plane. The disturbance current return path is considered through this GRP in the test set-up.Up to 1GHz, this ground reference plane will have neglectable influence on the measurement set-up and can be disregarded. 參考接地面(GRP)被認為是一個整片的接地面。在測試設置認為擾動電流返回路徑是通 過這個參考接地面。1GHz以下時,在測試裝置上這個接地面可忽略其影響。 The test board consists of at least two copper layers on an FR4 carrier material. The device under test, associated devices and tracks are placed on the topside. The bottom side is dedicated to a solid ground plane. A test board build-up is presented in Figure CNS ,28, B.3. 測試板由至少兩個銅層的FR4載體。待測裝置、相關設備和線路放置在上方。底 部是一個專用整片的接地面。一個測試板呈現於圖B.3。 Figure B.3 - Test board build-up 輔助電路 待測IC 頂部 信號走線 整片的接地面 底部 圖B.3 測試板建立 The test board bottom side, being a GND plane, is placed on the copper test fixture, connected to the ground reference plane as shown in Figure B.4. The copper test fixture shall be able to carry the BCI bottom test board conductively. The test fixture is placed on a copper ground reference plane (GRP). The shield of the injection probe has to be grounded underneath the copper test fixture to the GRP.It is recommended in order to ensure reproducibility, when large current probes have to be supported. 測試板下方為接地平面,是用於設置連接到參考接地面的銅質測試治具的位置,如圖B.4 所示。銅質測試治具應能夠導電至大電流注入測試板的下方。這個測試治具應被設置於銅 質參考接地面(GRP)上。注入探棒的屏蔽必需與銅質測試治具的參考接地面作接地。為了確 保其再現性,建議支撐大電流探棒。 Figure B.4 - Test board and copper fixture CNS ,29, 圖B.4 測試板與銅質治具 To fix the position of probes, a specific support is recommended.An example of that suppor is shown in Figure B.5. The probe support shall be made of non-conductive materials, with an εr of around 4. 要固定該位置的探棒,推薦一個具體的支撐。該支撐的範例示於圖B.5。探棒支撐應以一具 有介電係數大約為4的非導電材料製成。 Figure B.5 - Example of a non-conductive probes support fixture 注入探棒 測試探棒 CNS ,30, 圖B.5 非導體探棒支撐治具的範例 CNS ,31, Annex C (Informative) 附錄C (參考) Example of RF test board and set-up 射頻測試板範例與設置 As an RF probe injection, a multi-wire RF transformer can be used, e.g. a SMD type. Coupling onto a differential transmission line with a ground plane underneath can be performed with a 3-wire RF transformer, and its frequency range can be extended by adding capacitive coupling (increase capacitances: C4/C5 in Figure C.1). The wire is then used for injection where the off center wires are in series with the differential transmission line. 當射頻探棒注入時,可使用多線的射頻轉換器,例如SMD類型。耦合至有接接地面之差模 傳輸線時,可運用三線射頻轉換器,利用加入耦合電容可將頻率範圍擴展(在圖C1增加電 容,C4/C5)。使用轉換器的電線注入,其中非中心的電線與差模傳輸線串接。 Figure C.1 – Compact RF coupling to differential IC ports CNS ,32, 三線射頻變壓器 待測 裝置 幅 輔助電路 射頻干擾線 傳輸線 傳輸線 圖C1 緊密(Compact)射頻耦合至IC的差模埠 CNS ,33, Bibliography 參考目錄 [1] ISO 11452-4:2005, Road vehicles – Component test methods for electrical disturbances from narrowband radiated electromagnetic energy – Part 4: Bulk current injection (BCI) [1] ISO 11452-4:2005道路車輛?窄頻帶的電磁輻射能量擾動的元件測試方法?第4部:大電流 注入法(BCI)。 [2] DO160D section 20.4: Conducted Immunity (CS) test [2] DO160D 20.4,傳導耐受性(CS)測試。 [3] MIL-STD-461E: Requirements for the Control of Electromagnetic Interference Characteristics of Equipments and Subsystems (CS114) [3] ]MIL-STD-461E,控制設備與次系統的電磁干擾特性的需求。 編訂說明,本案建議案號為「建-制1020259」,草案編號為「草-制1020385」,係由林漢 年委員編擬,依程序辦理徵求意見,敬請 惠賜卓見。 CNS ,34, CNS ,35,