侧发光LED

AELWU-D-20mA Page 1 of 21 APPROVAL SHEET MODEL NAME SMD LED, PURE WHITE, SIDE VIEW PART NUMBER AELWU-D-20mA CUSTOMER NAME General Customer DATE 2007/3 Version 5 MAKER CUSTOMER Prepared Checked Approved AOT HEAD QUARTER No. 13, Gongye 5th. Road, Hsinchu Inustrial Park, Hukou Shiang, Hsinchu Hsien 303, TAIWAN, R.O.C. TEL: 886-3-597-6988 / FAX: 886-3-598-7392 AELWU-D-20mA Page 2 of 21 Revision note Date Revision Page Remark 2004-10-17 Initiate Document 17 1 1.Company Address Modification 2.Add Die shear & Wire pull SPEC 3.Add SGS 4.Add ESD SPEC. 5.Add process flow chart 2005-01-14 6.Add CIE SPEC 20 2 1.CIE SPEC. Modification ������� �� � 2.Part number change 20 3 1.Add Brightness SPEC 2006/3/21 2.Add Dimension spec. 20 4 1.Iv SPEC. Modification 2007/3/20 2.Part number change 21 5 AELWU-D-20mA Page 3 of 21 Dimension Side View LED : AELWU-D Dimension Type : AELWU-D Unit : mm Tolerance : +/- 0.10 ����������������������������� �� ������ �� ������ �� ������ �� � ���� � ����� �� �� ����� �� �� ����� �� �� ����� �� � ���� AELWU-D-20mA Page 4 of 21 • • SMD type Side-View white LED. • Lead frame package with individual 2 pins. • Soldering pad the plane accuracy of < 0.05mm ( interval B ) • White house the plane compare with soldering pad accuracy of < 0.05mm (interval A) • Wide viewing angle (110°) • Compact package outline (L x W x H) of 2.8 x 1.2 x 0.8 mm accuracy of ±0.1mm • Compatible to both of the lead and lead-free lR reflow soldering methods. • Pb free package. • The drawing is just for reference AELWU-D-20mA Page 5 of 21 Absolute Maximum Ratings (Ta=25� Item Symbol Absolute Maximum Rating Unit Forward Current IF 30 mA *Pulse Forward Current IFP 100 mA *Reverse Voltage VR 5 V Power Dissipation PD 120 mW Operating Temperature Topr -30~+85 � Storage Temperature Tstg -40~+100 � Soldering Temperature Tsld Reflow Soldering : 260� for 10sec Hand Soldering : 350� for 3sec *IFP Conditions : Pulse Width � 10msec, and duty � 1/10 Initial Electrical/Optical Characteristics (Ta=25�) Item Symbol Condition Min. Typ. Max. Unit Rank 0 2.9 3.0 Rank 1 3.0 3.1 Rank 2 3.1 3.2 Rank 3 3.2 3.3 Rank 4 3.3 3.4 Rank 5 3.4 3.5 Rank 6 3.5 3.6 Forward Voltage Rank 7 VF If=20mA 3.6 3.7 V Rank A 1000 1050 Rank B 1050 1100 Rank C 1100 1150 Rank D 1150 1200 Rank E 1200 1260 Rank F 1260 1330 Rank G 1330 1400 Luminous Intensity Rank H IV If=20mA 1400 1480 mcd * Vf tolerance: �0.05V * Dominant wavelength tolerance: �1nm * AOT reading. Luminous intensity is measured with an accuracy �10% with current pulse of 5ms Die shear , Wire pull and Ball shear SPEC. Zener diode �100g Die shear Chip�80g Wire pull �6g Ball shear �40g AELWU-D-20mA Page 6 of 21 Color Ranks � � �� � � �� �� 0.29 0.295 0.2925 � � � � � �� 0.2875 0.2925 0.2867 � � � � � � �� 0.295 0.295 0.29 0.29 �� 0.29 0.29 0.2784 0.2784 � � � � � �� �� 0.2817 0.2867 0.2809 0.2759 �� 0.2759 0.2809 0.275 0.27 �� 0.2784 0.2784 0.2667 0.2667 �� 0.2667 0.2667 0.255 0.255 � � �� � � �� �� 0.27 0.275 0.27 0.265 �� 0.2650 0.2700 0.2650 0.2600 �� 0.255 0.255 0.245 0.245 �� 0.2350 0.2450 0.2450 0.2350 � � �� � � �� �� 0.2975 0.3000 0.2950 0.2925 �� 0.2917 0.2975 0.2925 0.2867 �� 0.2900 0.2950 0.2950 0.2900 �� 0.2783 0.2900 0.2900 0.2783 � � � � � � � � � � � � � �� � � �� �� 0.2859 0.2917 0.2867 � � � � � � � �� 0.2800 0.2859 0.2809 � � � � � �� 0.2666 0.2783 0.2783 0.2666 �� 0.2550 0.2666 0.2666 0.2550 � � �� � � �� �� 0.2750 0.2800 0.2750 0.2700 �� 0.2700 0.2750 0.2700 0.2650 �� 0.2450 0.2550 0.2550 0.2450 �� 0.2350 0.2450 0.2450 0.2350 � � �� � � � �� 0.3025 0.3050 0.3000 0.2975 �� 0.2967 0.3025 0.2975 0.2917 �� 0.2900 0.2950 0.2950 0.2900 �� 0.2783 0.2900 0.2900 0.2783 � � � � � �� �� 0.2909 0.2967 0.2917 0.2859 �� 0.2850 0.2909 0.2859 0.2800 �� 0.2666 0.2783 0.2783 0.2666 �� 0.2550 0.2666 0.2666 0.2550 � � � � � � � � � � � � � �� � � � �� 0.2800 0.2850 0.2800 0.2750 �� 0.0750 0.2800 0.2750 0.2700 �� 0.2450 0.2550 0.2550 0.2450 �� 0.2350 0.2450 0.2450 0.2350 � � �� � � �� �� 0.3075 0.3100 0.3050 0.3025 �� 0.3017 0.3075 0.3025 0.2967 �� 0.2900 0.2950 0.2950 0.2900 �� 0.2783 0.2900 0.2900 0.2783 AELWU-D-20mA Page 7 of 21 � � �� � �� �� 0.2959 0.3017 0.2967 0.2909 �� 0.2900 0.2959 0.2909 0.2850 �� 0.2666 0.2783 0.2783 0.2666 �� 0.2550 0.2666 0.2666 0.2550 � � �� � �� �� 0.2850 0.2900 0.2850 0.2800 �� 0.2800 0.2850 0.2800 0.2750 �� 0.2450 0.2550 0.2550 0.2450 �� 0.2350 0.2450 0.2450 0.2350 If color binning is required, only one color group is allowed for each chip within a reel. Chromaticity coordinate groups are measured with an accuracy of ±0.01. 0.230 0.235 0.240 0.245 0.250 0.255 0.260 0.265 0.270 0.275 0.280 0.285 0.290 0.295 0.300 0.255 0.260 0.265 0.270 0.275 0.280 0.285 0.290 0.295 0.300 0.305 0.310 0.315 CIE - X CI E - Y H GA I R Q B P O N M X W V U T S F L E K D J C AELWU-D-20mA Page 8 of 21 Heavy metal analysis AELWU-D-20mA Page 9 of 21 Material Material 1. Lead-frame. Cu Alloy With Ni , Ag Plating. 2. Package. High Temperature Resistant Plastic, PPA. 3. Encapsulation Silicon Resin. 4. Soldering Leads. Sn-Sn Plating. 5. Die InGaN based 6. Bonding wire Au Note: Product is lead-free ( Pb free). AELWU-D-20mA Page 10 of 21 Optical & Electrical Characteristics Forward Voltage vs. Forward Current Forward Current vs. Relative Luminosity 1 10 100 2.5 3 3.5 4 4.5 Forward Voltage Vf (V) Fo rw a rd Cu rr e n t I fp (m A) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 Forward Current Ifp (mA) � � �� �� � � � � �� � �� � �� � �� �� Duty Ratio vs. Allowable Forward Current Ambient Temperature vs. Forward Voltage 10 100 1000 1 10 100 ��������� � �� � �� �� � �� � � � � � � �� � �� �� �� �� � � ��� ��� � �� � � � � � � � �� � � � � � � � �� � �� � � � � � � �� Ambient Temp. Ta (�) Fo rw ar d Vo lta ge Vf (V ) � � � � � � � � � �� � � � � � � � � � Ambient Temperature vs. Relative Luminosity Ambient Temperature vs. Allowable Forward Current ��� ��� ��� � �� � �� � �� � �� � �� � � � � � � �� � � � � � �� Ambient Temp. Ta ( ) Re la tiv e Lu m in o us (a. u. ) � � � � � � � � � � � � � � � � � � � � � � � � � � �� Ambient Temp. Ta ( ) � �� � � � �� �� � � � � �� � � �� �� � �� � � � Ta=25� Ta=25� Ta=25� IFP=20mA AELWU-D-20mA Page 11 of 21 Forward Current vs. Chromaticity diagram Spectrum ���� ���� ���� ���� ��� � ��� ��� � ��� � ���� ��� � ��� ��� � ��� � � � � � �� �� Ambient Temperature vs. Chromaticity Diagram Directivity ���� ���� ��� � ��� � ��� � ���� �� � � �� � � �� � � �� � � � � � � �� �� 0 o10 o 70 o 60 o 50 o 40 o 30 o 20 o 90 o 80 o 0.6 0.8 1.0 0.2 0.4 0 Dominant Wavelength vs Relative Intensity 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 400 450 500 550 600 650 700 Wavelength (nm) Re la tiv e In te n s ity Ta=25� Ta=25� IF=20mA IFP=20mA Ta=25� IF=20mA 1mA 5mA 10mA 20mA 50mA 100mA 85� 50� 25� 0� -30� AELWU-D-20mA Page 12 of 21 Recommended Soldering Temperature – Time Profile (Reflow Soldering) Surface Mounting Condition In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices. Soldering Reflow -Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering. -In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -AOT cannot guarantee the LEDs after they have been assembled using the solder dipping method. 1) Lead Solder Classification Reflow Profile (JEDEC J-STD-020C) 25 50 75 100 125 150 175 200 225 250 275 0 50 100 150 200 Time (sec) Te m pe ra tu re (o C ) Preheat 60-120s 183 oC 60-150s Ramp-up 3 oC/sec max. Ramp-down 6 oC/sec max. 235-240oC 5-10s 360s max AELWU-D-20mA Page 13 of 21 2) Lead-Free Solder (JEDEC J-STD-020B). Classification Reflow Profile (JEDEC J-STD-020C) 25 50 75 100 125 150 175 200 225 250 275 300 0 50 100 150 200 Time (sec) Te m pe ra tu re (o C ) Preheat 60-180s 217 oC 60-150s Ramp-up 3 oC/sec max. Ramp-down 6 oC/sec max. 260-255oC 5-10s 480s max 3) Manual Soldering. - Lead Solder Max. 300� for Max. 3sec, and only one time. - Lead-free Solder Max. 350� for Max. 3sec, and only one time. - There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method - After LEDs have been soldered, repairs should not be done. As repairs is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not. - Reflow soldering should not be done more than two times AELWU-D-20mA Page 14 of 21 AELWU-D-20mA Page 15 of 21 Reliability (1) TEST ITEMS AND RESULTS No. Test Item Standard Test Method Test Conditions Note Sample Size Pass 1 Steady State Operating Life Internal Ref. If = 40 mA 168 Hr 20 OK 2 Steady State Operating Life Internal Ref. If = 20 mA 1000 Hr 20 OK 3 Reflow Test JESD22-B102-C 240C max 2 Times 20 OK 4 Thermal Shock JESD22-A106-A -40C ~ 85C 84 Cycles 20 OK 5 Temperature Cycle JESD22-A104-A -35C ~ 75C 168 Cycles 20 OK 6 High Temperature Storage JESD22-A103-A 100C 168 Hr 20 OK 7 Low Temperature Storage Internal Ref. -40C 168 Hr 20 OK 8 High Temperature High Humidity JESD22-A101-B 85C,85%RH 168 Hr 20 OK 9 Pressure Cook JESD22-A102B 121C,P=2atm 100%RH 168 Hr 20 OK 10 On-Off Test Internal Ref. 2 sec ON - 2sec OFF 100,000 cycle 20 OK 11 ESD Test CEI IEC 6100-4-2, 1995 HBM+/-2000V MM +/- 200V 1 time 20 OK � HTHH have two model at turn on and turn off . Environmental Specification Temperature Cycle Test (air to air) - Side-View LEDs must be subjected to following conditions ; 1) 30 min at +70�, 2) 15 sec maximum at room temperature, 3) 30 min at –30�, 4) 15 sec maximum at room temperature. Subject samples to ten (10) cycles. Humidity Test - Side-View LEDs must be subjected to +85�, 90% RH for 200 hours, and expose to room temperature for 6 hours. Storage Temperature Test - Side-View LEDs must be subjected to each temperatures at +85� and –40� for 96 hours and expose to room temperature for 2 hours. AELWU-D-20mA Page 16 of 21 (2) CRITERIA FOR JUDGING THE DAMAGE Criteria for Judgement Item Symbol Test Conditions Min. Ma. Forward Voltage Vf If=20mA U.S.L. * 1.1 Luminous Intensity Iv If=20mA L.S.L. * *0.7 *U.S.L.: Upper Standard Level **L.S.L.: Lower Standard Level Materials and Characteristics Carrier Tape Cover Tape Description Typical Value Unit Description Typical Value Unit Material Polycarbonate � Thickness 0.048 mm Tensile Strength(yield) 65 Mpa Tensile Strength(break) 64 N/mm Impact Strength(notched) 10.2 Kg-cm/cm Elongation(length) 140 % Elongation 105 % Elongation(lateral)) 145 % Shrinkage <1.0 mm Tear Strength(length) 0.20 N/mm Surface resistivity 10E4-10E6 Ohm/sq Tear Strength(lateral) 0.19 N/mm Volume resistivity <10E6 ohm-cm Surface resistivity (Surface) <10E11 Ohm/sq � � � Surface resistivity (sealing) <10E11 Ohm/sq [Recommended soldering pad design] Use the following conditions shown in the figure. {Unit : mm} AELWU-D-20mA Page 17 of 21 ESD Test SPEC.: ESD Test Result: � � � � � ESD HBM Test Results MODEL: HBM ESD SENSITIVITY PASS:: ���� � � V V CLASS: 2 PIN SAMPLE NOTE: COMBINATION SIZE FOR MIL-STD � � � � PASSED VOLTS CLASS1: 0V-1999V VDD (+) vs. VSS 5 ���000V� CLASS2: 2000V-3999V VDD (-) vs. VSS 5 ���� � � � CLASS3: 4000V-TO ABOVE � � � ESD MM Test Results MODEL: MM ESD SENSITIVITY PASS: ���� � V V CLASS: M3 PIN SAMPLE NOTE: COMBINATION SIZE FOR ANSI/ESD-S5.2-1994 � � � � CLASS M1: 0V - 100 V � � � � CLASS M2: 101V - 200 V � � � � PASSED VOLTS CLASS M3: 201V - 400 V VDD (+) vs. VSS 5 ���� � � CLASS M4: 401V- 800 V VDD (-) vs. VSS 5 ���� � � CLASS M5: >800V AELWU-D-20mA Page 18 of 21 Packing Formation Package Outlook: Customer Part Number Quantity Date Remark 230 260 95 240 270 5 Bags / 1Inner Box AELWU⇒ 10,000 pcs/ 1 Inner Box Aluminum Bag, Anti-Static Shielding 1 Reel / Bag ( T = 0.1 mm ) Diameter : 178 mm Width : 12 mm AELWU⇒ 2,000 pcs/Reel Anti-Static Black Reel 530 375 5 Inner Box/1 Carton AELWU⇒ 50,000 pcs/ 1Carton 300 270 205 375 215 149 105 Advanced Optoelectronic Technology Inc AELWU-D-20mA Page 19 of 21 Reel Label Definition A,K: lower and higher brightness range E : CIE value noted, A-1.2,B-1.2,C-1.2, and D-1.2 0,6 : Vf min to high nn : Quantity of LED SHyymmddxxx : yy : year, mm : month, dd : day, xxx : reel no *Reel Label to fill in practice data of all LED characteristic . SMD LED, Sideview AELWU-D Pure White Part Number : AELWU-D (20mA) Brightness : A ~ H mcd CIE : E Vf : 0 ~ 6 Quantity : nn ea Serial No : SHyymmddxxx AELWU-D-20mA Page 20 of 21 Side View Process Flow Materiel IQC Chip Inspection ��������� �� � � � �� � cutting Die Bond Wire Bond Baking � � � � � �� � � � � � � � � CIE,Iv,Vf Sorting packing OQC 200 pcs check per reel, Labeling check. � � � � � �� � � � � OK OK NG NG Final packing Shipping OK NG AELWU-D-20mA Page 21 of 21 CAUTIONS (1) Moisture Proof Package The moisture proof package should be used to prevent moisture in the package as the moisture may cause damage to optical characteristics of the LEDs. The aluminum bag with zipper is used for moisture proof package. And, the moisture absorbent material, Silica gel, is inserted into aluminum bag. (2) Storage: Storage Conditions Before opening the package: The LEDs should be kept at 30� or less than 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material is recommended. After opening the package: After open the package, the LED should be kept at 30°C, 60%RH or less. The LED should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, it should be stored in moisture proof condition. (3) Heat Generation Thermal design of the end products is of paramount importance. The heat generation must be taken into design consideration when using the LED. The coefficient of the temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. (4) Static Electricity Static electricity or surge voltage damages the LEDs. All equipment and machinery must be properly grounded. It is recommended to use a wristband or anti-electrostatic glove when handing the LEDs. When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a Vf tes tat a lower current. (below 1mA is recommended). Criteria: Vf >2.0V at If=0.01 mA (5) Cleaning Use isopropyl alcohol as a solvent for cleaning the LEDs. The other solvent may dissolve the LEDs package and the silicon. Ultrasonic cleaning should not be done. (6) Others When using the LEDs, it must care that the reverse voltage will not exceed the absolute maximum rating. The LED light is enough to injure human eyes, so it should avoid looking at LED light directly. NOTE. All the information published is considered to be reliable. However, AOT does not assume any liability arising out of the application or use of any product described herein. AOT reserves the right to make changes at any time without notice to any products in order to improve reliability, function or design. AOT products are not authorized for use as critical components in life support devices or systems without the express written approval from the managing director of AOT.