RMA-223-AS

AMTECH Product Description � Exceptional print definition � Long stencil life � Wide process window � Excellent wetting compatibility on most board finishes � Low voiding � Compatible with enclosed printing heads Alloys AMTECH manufactures a low-oxide, spherical and uniformly sized powder. RMA-223-AS is available in the following alloys: 63Sn/37Pb, 62Sn/36Pb/2Ag, 60Sn/Pb40, 43Sn/43Pb/14Bi and 42Sn/58Bi. Powder Distribution Available Packaging The following packaging options are available for stencil printing and dispensing applications: 250g and 500g jars; 250g and 700g cartridges; 750g ProFlow® cassettes; 35g and 100g syringes; 2,500g FreshMix® Kits. Stencil Life >8 hrs. @ 30–45% RH & 22–25°C ~4 hrs. @ 45–70% RH & 22–25°C Viscosity Printing applications: 750 to 1,100Kcps +/-10% Dispensing applications: 500Kcps +/-10% Tested according to IPC-TM-650 Tack Value Typical tackiness: 48g force Printing The print definition of RMA-223-AS is ideal for fine pitch applications. The stencil life of this RMA product virtually eliminates waste of solder paste. Consult the powder distribution chart to determine your mesh size requirements. Printer Operation The following are general guidelines for stencil printer optimization with RMA-223-AS. Some adjustments may be necessary based on your process requirements. Print Speed: 25–100mm/sec Squeegee Pressure: 0.2–0.7kg/inch of blade Under Stencil Wipe: Once every 10–25 prints or as necessary Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Storage and Handling Procedures Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months. Syringes & cartridges should be stored vertically with the dispensing tip down. Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE. (continued) Advanced SMT Solder Products Product Data Sheet RMA-223-AS Rosin Mildly Activated Solder Paste Micron Size Type Pitch Requirements 75 - 45 Type-2 24mil & above 45 - 25 Type-3 16mil to 24 mil 38 - 20 Type-4 12mil to 16mil 25 - 15 Type-5 <12mil 15 - 5 Type-6 <8mil 75 School Ground Road Branford, CT 06405 Toll free: 800-435-0317 Phone: 203-481-0362 Fax: 203-481-5033 www.amtechsolder.com An ISO 9001 Certified Company RMA-223-AS Rosin Mildly Activated Solder Paste Time (Sec.) Te m p . (º C ) 250 220 200 183 150 100 50 0 0 30 60 90 120 150 180 210 240 270 300 Topside temperature of board to be @ 205-220°C Ramp Profile Profile-A for Sn62 & Sn63 alloy Liquidus Temperature for Sn62 & Sn63 alloys Reflow Time: 30-60 Sec. Reflow Zone Cooling RAMP @ < 1.0°C/Second Soak Temp 140-180°C Soak Time 60-90 Sec Pre-heat 1 Pre-heat 2 Soaking Zone Time (Sec.) Te m p . (º C ) 250 220 200 183 150 100 50 0 Profile-B for Sn62 & Sn63 alloy Liquidus Temperature for Sn62 & Sn63 alloys Reflow Time: 30-60 Sec. Reflow Zone Cooling RAMP @ < 1.0°C/Second Soak Temp 140-180°C Soak Time 90-120 Sec Pre-heat 1 Pre-heat 2 Soaking Zone Test Standard Values Results Flux Designator IPC-TM-650 2.3.35 NA ROM0 Copper Mirror IPC-TM-650 2.3.32 NA PASS Silver Chromate IPC-TM-650 2.3.33 NA PASS SIR Test IPC-TM-650 2.6.3.3 2.00E+10 PASS J-STD-004 (IPC-TM-650) Test Results Recommended Profiles: Profile-A was designed to serve as a starting point for process optimization using RMA-223-AS. A cool down rate of (-) 2–4°C/second is ideal for the formation of a fine grain structure without risking damage to thermally sensitive components. A profile utilizing a soak of up to two minutes at 155°C may help to minimize voiding in BGA assembles. This will allow more time for solvent components of the solder paste to outgas prior to reflow. The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Users of our products should make their own tests to determine the suitability of each product for their particular process. AMTECH will assume no liability for results obtained or damages incurred through the application of the data presented. Rev: 10/09 Topside temperature of board to be @ 205-220°C Soak Profile AMTECH Advanced SMT Solder Products F I L L I N G T H E V O I D RMA-223-AS Solder Paste 75 School Ground Road Branford, CT 06405 Toll free: 800-435-0317 Phone: 203-481-0362 Fax: 203-481-5033 www.amtechsolder.com 0 30 60 90 120 150 180 210 240 270 300 Flux Activation Temperature Flux Activation Temperature