RMA_223_LF

AMTECH Product Description n Exceptional print definition n Long stencil life n Wide process window n Excellent wetting compatibility on most board finishes n Low voiding n Compatible with enclosed printing heads Alloys AMTECH manufactures a low-oxide, spherical and uniformly sized powder. RMA-223-LF is available in the following alloys: Sn96.5/Ag3.5, Sn95/Ag5, and Sn95/Sb5 alloys. Powder Distribution Available Packaging The following packaging options are available for stencil printing and dispensing applications: 250g and 500g jars; 250g and 600g cartridges; 650g ProFlow® cassettes; 35g and 100g syringes; 2,500g FreshMix® Kits. Stencil Life 6-8 hrs. @ 30–45% RH & 22–25°C ~4 hrs. @ 45–70% RH & 22–25°C Viscosity Printing applications: 700 to 1,100Kcps +/-10% Dispensing applications: 400Kcps +/-10% Tested according to IPC-TM-650 Tack Value Typical tackiness: 34g force Printing The print definition of RMA-223-LF is ideal for fine pitch applications. The stencil life of this water-soluble product virtually eliminates waste of solder paste. Consult the powder distribution chart to determine your mesh size requirements. Printer Operation The following are general guidelines for stencil printer optimization with RMA-223-LF. Some adjustments may be necessary based on your process requirements. Print Speed: 25–100mm/sec Squeegee Pressure: 0.2–0.7kg/inch of blade Under Stencil Wipe: Once every 10–25 prints or as necessary Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well. Advanced SMT Solder Products Product Data Sheet RMA-223-LF Rosin Mildly Activated Solder Paste Micron Size Type Pitch Requirements 75 - 45 Type-2 24mil & above 45 - 25 Type-3 16mil to 24 mil 38 - 20 Type-4 12mil to 16mil 25 - 15 Type-5 <12mil 15 - 5 Type-6 <8mil 75 School Ground Road Branford, CT 06405 Toll free: 800-435-0317 Phone: 203-481-0362 Fax: 203-481-5033 www.amtechsolder.com An ISO 9001 Certified Company RMA-223-LF Rosin Mildly Activated Solder Paste Storage and Handling Procedures Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months. Syringes & cartridges should be stored vertically with the dispensing tip down. Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE. (continued) Test Standard Values Results Flux Designator IPC-TM-650 2.3.35 NA ROM1 J-STD-004 (IPC-TM-650) Test Results Recommended Profile: This profile was designed to serve as a starting point for process optimization using RMA-223-LF. A cool down rate of (-) 2–4°C/second is ideal for the formation of a fine grain structure without risking damage to thermally sensitive components. The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Users of our products should make their own tests to determine the suitability of each product for their particular process. AMTECH will assume no liability for results obtained or damages incurred through the application of the data presented. Rev: 10/09 AMTECH Advanced SMT Solder Products F I L L I N G T H E V O I D RMA-223-LF Solder Paste 75 School Ground Road Branford, CT 06405 Toll free: 800-435-0317 Phone: 203-481-0362 Fax: 203-481-5033 www.amtechsolder.com Time (Sec.) Te m p . (º C ) 300 250 219 200 150 100 50 0 0 30 60 90 120 150 180 210 240 270 300 330 Profile for Sn96.5/Ag3.5 alloys Liquidus Temperature Reflow Time: 30-60 Sec. Reflow Zone Cooling RAMP @ < 2.0°C/Second Soak Temp 140-200°C Soak Time 60-90 Sec Pre-heat 1 Pre-heat 2 Soaking Zone Flux Activation Temperature Peak Temperature (Min 230°C–Max 249°C)